Evaporation Material
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About Us
History
Introduction
Location
Product & Service
Targets
Evaporation Material
Backing Plates
Mo, Ta, Cr, Nb, W, Zr
High Purity Materials
Solder Bonding
Diffusion Bonding
Technology
Sputtering
Bonding
Fine Structure Control
Powder Metallurgy
Contact Us
Contact Us
Targets
Evaporation Material
Backing Plates
Mo, Ta, Cr, Nb, W, Zr
High Purity Materials
Solder Bonding
Diffusion Bonding
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“We can meet your various specific need : materials, purity, and shapes. Please contact us”
Total
10
1
10
Al ball
9
Al alloy pellet
8
Cu pellet
7
Al alloy chip
6
Cr cone
5
Cr tablet
4
Ag granule
3
Al Pellet
2
Au granule
1
Ni Chip
About Us
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Location
Applied Science Corp. / 130-3, Saeori-ro, Tanhyeon-myeon, Paju-si, Gyeonggi-do, 10858, Republic of Korea / Copyright (c)
Applied Science Corp.
All rights reserved.
TEL : +82-31-944-4931 / FAX : +82-31-942-4932 / E-mail :
info@appliedscience.co.kr