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Product & Service
Targets
Evaporation Material
Backing Plates
Mo, Ta, Cr, Nb, W, Zr
High Purity Materials
Solder Bonding
Diffusion Bonding
Technology
Sputtering
Bonding
Fine Structure Control
Powder Metallurgy
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2019
01
Production of Oxygen free copper and Silver bearing copper
2017
Factory relocation
01
2013
01
Production of Ceramic targets
2012
Production of OLED materials
01
2009
06
Accredited to ISO 14001 (Became ISO 14001 Accredited)
2008
Developed Cu Target for 7th Generation LCD Manufacturing Line
12
2007
04
Accredited to ISO 9001 (Became ISO 9001 Accredited)
2006
Developed Ti Target for 300 mm Diameter Si Wafer
10
2005
08
Expanded and Relocated Manufacturing Facility
2004
Passed Qualification Test of Ti Target for DRAM Mass Production Line by
Hynix Semiconductor
04
2000
05
Established Al Precision Forging Technology
02
Established Ti-Al Diffusion Bonding Technology
Established Ti Target Manufacturing and Processes for Ultra Fine Grain Structure
1999
Exported Ag Targets
04
1998
05
Incorporated
Attracted Investment from POSTECH Venture Capital
About Us
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Location
Applied Science Corp. / 130-3, Saeori-ro, Tanhyeon-myeon, Paju-si, Gyeonggi-do, 10858, Republic of Korea / Copyright (c)
Applied Science Corp.
All rights reserved.
TEL : +82-31-944-4931 / FAX : +82-31-942-4932 / E-mail :
info@appliedscience.co.kr