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Large grain sizes and/or divergent grain sizes reduce the thickness uniformity of deposited films. In addition, large grain sizes increase the particle generation due to the large precipitates at grain boundaries.
Small grain sizes also increase the life time of target.
Pictures of Fine Grain Structures of Our Sputtering Targets
Ti sputtering Target
average grain size: ~8㎛(x1000)
Cu sputtering Target
average grain size: ~14㎛(x500)
Al sputtering Target
average grain size: ~50㎛(x50)